Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
For laser
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General use
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Halogen-free low silver
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Low void
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Compatible with formic acid reflow
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Epoxy resin
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Low melting point
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Epoxy resin low melting point
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Non-Halogen solder paste with low melting point
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Low Ag
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Water-soluble
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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General use(compatible with normal temperature strage)
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High strength
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Hallogen Free
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