Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Low void
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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General use
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Low Ag
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Hallogen Free
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General use(compatible with normal temperature strage)
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For laser
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Epoxy resin low melting point
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Non-Halogen solder paste with low melting point
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Halogen-free low silver
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Water-soluble
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High strength
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Epoxy resin
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Less flux residue
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Low melting point
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Low Ag
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Halogen free (compatible with normal temperature storage)
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