Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Epoxy resin low melting point
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For laser
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Halogen-free low silver
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General use(compatible with normal temperature strage)
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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High strength
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General use
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Non-Halogen solder paste with low melting point
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Low void
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Compatible with formic acid reflow
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Water-soluble
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Less flux residue
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Low Ag
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Low Ag
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Low melting point
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Halogen free (compatible with normal temperature storage)
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