Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Epoxy resin low melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLow Ag
Read MoreHallogen Free
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHalogen-free low silver
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreNon-Halogen solder paste with low melting point
Read MoreFor laser
Read MoreLow Ag
Read MoreLess flux residue
Read MoreLow melting point
Read MoreWater-soluble
Read MoreCompatible with formic acid reflow
Read MoreHigh strength
Read MoreEpoxy resin
Read MoreLow void
Read MoreGeneral use
Read More