Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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General use(compatible with normal temperature strage)
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Non-Halogen solder paste with low melting point
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For laser
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Low Ag
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Less flux residue
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Low melting point
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Water-soluble
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Compatible with formic acid reflow
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High strength
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Epoxy resin
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Low void
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General use
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