Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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Low void
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Low melting point
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High strength
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Halogen-free low silver
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Epoxy resin
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General use
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Low Ag
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Epoxy resin low melting point
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Water-soluble
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Low Ag
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For laser
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