Improved joint reliability
Suppressed crack growth by adding Bi and Sb,Furthermore,
while maintaining the melting characteristics due to the effect of the additive elements
Improved joint reliability compared to SAC305.
Thermal shock test (shear strength)
Thermal shock test (cross-section observation)
Basic characteristics
Less flux residue
Read More
Low melting point
Read More
Halogen-free low silver
Read More
Epoxy resin
Read More
Hallogen Free
Read More
Halogen free (compatible with normal temperature storage)
Read More
Compatible with Ni
Read More
Halogen free (compatible with normal temperature storage)
Read More
Non-Halogen solder paste with low melting point
Read More
Water-soluble
Read More
General use(compatible with normal temperature strage)
Read More
Low Ag
Read More
For laser
Read More
Epoxy resin low melting point
Read More
Low Ag
Read More
Compatible with formic acid reflow
Read More
Low void
Read More
General use
Read More