Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Non-Halogen solder paste with low melting point
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Compatible with formic acid reflow
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Low Ag
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Epoxy resin low melting point
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Low Ag
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For laser
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Hallogen Free
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High strength
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General use
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Low melting point
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Water-soluble
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Compatible with Ni
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Low void
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