Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Compatible with formic acid reflow
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Epoxy resin
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Halogen-free low silver
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Low Ag
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Water-soluble
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High strength
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General use
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Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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Low void
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For laser
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Low melting point
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General use(compatible with normal temperature strage)
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Compatible with Ni
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Low Ag
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Halogen free (compatible with normal temperature storage)
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