Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
For laser
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Low Ag
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Low melting point
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Epoxy resin low melting point
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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General use
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Halogen-free low silver
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Low Ag
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Low void
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High strength
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Water-soluble
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Epoxy resin
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