Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Compatible with Ni
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General use(compatible with normal temperature strage)
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Epoxy resin
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Epoxy resin low melting point
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Non-Halogen solder paste with low melting point
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Halogen-free low silver
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Low melting point
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Halogen free (compatible with normal temperature storage)
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Low void
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High strength
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Low Ag
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Compatible with formic acid reflow
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Water-soluble
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For laser
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Low Ag
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General use
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