Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
General use(compatible with normal temperature strage)
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Low void
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Hallogen Free
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For laser
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General use
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Low Ag
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Halogen-free low silver
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Low Ag
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Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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Compatible with Ni
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High strength
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