Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low void
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Hallogen Free
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Water-soluble
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Epoxy resin
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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For laser
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Halogen-free low silver
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Epoxy resin low melting point
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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Compatible with Ni
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Low Ag
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Less flux residue
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High strength
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Compatible with formic acid reflow
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General use
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