Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
High strength
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Compatible with Ni
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Non-Halogen solder paste with low melting point
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Less flux residue
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Water-soluble
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Epoxy resin
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For laser
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Low void
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Low Ag
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Hallogen Free
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Halogen-free low silver
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General use
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