Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Less flux residue
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Low Ag
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Non-Halogen solder paste with low melting point
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Hallogen Free
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High strength
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Low void
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General use
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Epoxy resin low melting point
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Epoxy resin
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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Compatible with Ni
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Low Ag
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Halogen-free low silver
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For laser
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Halogen free (compatible with normal temperature storage)
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