Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low void
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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For laser
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Less flux residue
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Non-Halogen solder paste with low melting point
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Hallogen Free
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General use
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Epoxy resin
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Low Ag
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General use(compatible with normal temperature strage)
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Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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Low Ag
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Halogen-free low silver
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Compatible with formic acid reflow
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High strength
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