Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Halogen free (compatible with normal temperature storage)
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For laser
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Halogen-free low silver
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Compatible with formic acid reflow
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High strength
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Compatible with Ni
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Epoxy resin
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Low Ag
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Less flux residue
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Non-Halogen solder paste with low melting point
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Low void
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Epoxy resin low melting point
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General use
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Water-soluble
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Low Ag
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Hallogen Free
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