Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low void
Read MoreWater-soluble
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreFor laser
Read MoreLess flux residue
Read MoreNon-Halogen solder paste with low melting point
Read MoreHallogen Free
Read MoreGeneral use
Read MoreEpoxy resin
Read MoreLow Ag
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreCompatible with Ni
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreEpoxy resin low melting point
Read MoreLow Ag
Read MoreHalogen-free low silver
Read MoreCompatible with formic acid reflow
Read MoreHigh strength
Read More