Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Formic acid reflow test results
Basic characteristics
Water-soluble
Read MoreHalogen-free low silver
Read MoreFor laser
Read MoreLow Ag
Read MoreLess flux residue
Read MoreHallogen Free
Read MoreLow Ag
Read MoreLow void
Read MoreCompatible with Ni
Read MoreGeneral use
Read MoreNon-Halogen solder paste with low melting point
Read MoreLow melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreEpoxy resin
Read MoreEpoxy resin low melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreGeneral use(compatible with normal temperature strage)
Read More