The running cost of the tip can be greatly reduced
The frequency of soldering tip exchanges drastically decreasesï¼
Significant reduction of flux and solder ball spatteringï¼
Significant suppression of burnt residue and bubbles in flux residue
The running cost of the tip can be greatly reduced
The frequency of soldering tip exchanges drastically decreasesï¼
Significant reduction of flux and solder ball spatteringï¼
Significant suppression of burnt residue and bubbles in flux residue
Compatible product against tipping
Iron tip life about 4 times longer than NP303 composition. (Sn-3.0Ag-0.5Cu)
Spattering surppression effect
Suppressed spattering compared to conventional products.
Scorching / bubble suppression effect
Suppressed flux burnt and bubbles compared to conventional products.
Basic characteristics