Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Epoxy resin low melting point
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Compatible with Ni
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Hallogen Free
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Epoxy resin
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General use
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Low melting point
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Halogen-free low silver
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Compatible with formic acid reflow
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Low void
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General use(compatible with normal temperature strage)
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For laser
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Low Ag
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Low Ag
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High strength
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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Less flux residue
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