Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Less flux residue
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Epoxy resin
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For laser
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Compatible with Ni
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High strength
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Water-soluble
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Low void
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Halogen-free low silver
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Low melting point
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Low Ag
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General use
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Epoxy resin low melting point
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General use(compatible with normal temperature strage)
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Low Ag
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Halogen free (compatible with normal temperature storage)
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