Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Epoxy resin low melting point
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Compatible with formic acid reflow
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Less flux residue
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High strength
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Low Ag
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Water-soluble
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Halogen-free low silver
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Epoxy resin
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Low void
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Low melting point
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General use(compatible with normal temperature strage)
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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For laser
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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General use
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Hallogen Free
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