Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettabilityï¼
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettabilityï¼
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Hallogen Free
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Less flux residue
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Compatible with Ni
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Epoxy resin low melting point
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Low Ag
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Low Ag
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For laser
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Non-Halogen solder paste with low melting point
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Halogen-free low silver
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Compatible with formic acid reflow
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General use
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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High strength
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Low void
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Low melting point
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General use(compatible with normal temperature strage)
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Water-soluble
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Epoxy resin
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