Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Epoxy resin
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General use(compatible with normal temperature strage)
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Low Ag
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Compatible with Ni
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Low melting point
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Water-soluble
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High strength
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Less flux residue
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Hallogen Free
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Halogen-free low silver
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Non-Halogen solder paste with low melting point
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Low void
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General use
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For laser
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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