Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability!
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Compatible with formic acid reflow
Read MoreLess flux residue
Read MoreHallogen Free
Read MoreLow void
Read MoreWater-soluble
Read MoreNon-Halogen solder paste with low melting point
Read MoreEpoxy resin
Read MoreLow Ag
Read MoreFor laser
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreCompatible with Ni
Read MoreHalogen-free low silver
Read MoreLow Ag
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreLow melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreGeneral use
Read MoreEpoxy resin low melting point
Read More