Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Compatible with formic acid reflow
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Less flux residue
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Hallogen Free
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Low void
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Water-soluble
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Low Ag
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For laser
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Halogen-free low silver
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Low Ag
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General use(compatible with normal temperature strage)
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Low melting point
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Halogen free (compatible with normal temperature storage)
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High strength
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General use
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Epoxy resin low melting point
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