Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Halogen-free low silver
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Non-Halogen solder paste with low melting point
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General use
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For laser
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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Water-soluble
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Epoxy resin
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High strength
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Less flux residue
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Low Ag
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Compatible with Ni
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Halogen free (compatible with normal temperature storage)
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Low melting point
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Low Ag
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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Low void
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Hallogen Free
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