Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Compatible with formic acid reflow
Read More
General use
Read More
Less flux residue
Read More
Non-Halogen solder paste with low melting point
Read More
Hallogen Free
Read More
Halogen free (compatible with normal temperature storage)
Read More
Halogen-free low silver
Read More
General use(compatible with normal temperature strage)
Read More
Compatible with Ni
Read More
Low Ag
Read More
Low melting point
Read More
Halogen free (compatible with normal temperature storage)
Read More
Epoxy resin low melting point
Read More
Low Ag
Read More
Low void
Read More
For laser
Read More
Water-soluble
Read More
Epoxy resin
Read More
High strength
Read More