Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
For laser
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Epoxy resin low melting point
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Low Ag
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Compatible with Ni
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Low void
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Hallogen Free
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Water-soluble
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High strength
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Halogen free (compatible with normal temperature storage)
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General use
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Low melting point
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General use(compatible with normal temperature strage)
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Less flux residue
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Low Ag
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