Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Epoxy resin
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General use(compatible with normal temperature strage)
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For laser
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General use
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Less flux residue
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Water-soluble
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Compatible with Ni
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Hallogen Free
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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High strength
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Halogen-free low silver
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Low melting point
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Epoxy resin low melting point
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Low Ag
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Low void
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