Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Compatible with Ni
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Epoxy resin low melting point
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Water-soluble
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Low melting point
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For laser
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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Low Ag
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Non-Halogen solder paste with low melting point
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Low Ag
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General use
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Epoxy resin
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Low void
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Hallogen Free
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General use(compatible with normal temperature strage)
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High strength
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