Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
For laser
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Low Ag
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Epoxy resin
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General use(compatible with normal temperature strage)
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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Low void
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General use
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Halogen-free low silver
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Compatible with formic acid reflow
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Compatible with Ni
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Low melting point
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Low Ag
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Water-soluble
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High strength
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