Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Halogen free (compatible with normal temperature storage)
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High strength
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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Less flux residue
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Hallogen Free
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General use
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For laser
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Low void
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General use(compatible with normal temperature strage)
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Compatible with formic acid reflow
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Halogen-free low silver
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Low Ag
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Epoxy resin
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Water-soluble
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Non-Halogen solder paste with low melting point
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Compatible with Ni
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Low melting point
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