Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Non-Halogen solder paste with low melting point
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General use
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Epoxy resin low melting point
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Water-soluble
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Low void
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High strength
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Epoxy resin
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Low Ag
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Compatible with formic acid reflow
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Less flux residue
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For laser
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Halogen-free low silver
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Low Ag
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Low melting point
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Compatible with Ni
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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