Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
For laser
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Low void
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Epoxy resin low melting point
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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Epoxy resin
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Compatible with formic acid reflow
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High strength
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Low melting point
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Compatible with Ni
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Low Ag
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General use
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Low Ag
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