Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Compatible with formic acid reflow
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For laser
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General use
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Compatible with Ni
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High strength
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Halogen free (compatible with normal temperature storage)
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Low melting point
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General use(compatible with normal temperature strage)
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Halogen-free low silver
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Low void
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Low Ag
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Less flux residue
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Water-soluble
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Epoxy resin
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