Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Low Ag
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General use
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Epoxy resin
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Hallogen Free
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Less flux residue
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Low void
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Non-Halogen solder paste with low melting point
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Water-soluble
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Halogen-free low silver
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Low melting point
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For laser
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High strength
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Low Ag
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Compatible with Ni
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