Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Compatible with formic acid reflow
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Low Ag
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Low melting point
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Compatible with Ni
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Non-Halogen solder paste with low melting point
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Less flux residue
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High strength
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General use
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Low Ag
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Halogen free (compatible with normal temperature storage)
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For laser
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Low void
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General use(compatible with normal temperature strage)
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Water-soluble
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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Hallogen Free
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Halogen-free low silver
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