Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Less flux residue
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Halogen free (compatible with normal temperature storage)
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Low void
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High strength
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General use(compatible with normal temperature strage)
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Low Ag
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For laser
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General use
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Epoxy resin
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Hallogen Free
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Compatible with Ni
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Low melting point
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Water-soluble
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Compatible with formic acid reflow
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Epoxy resin low melting point
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Halogen-free low silver
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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