Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Hallogen Free
Read MoreNon-Halogen solder paste with low melting point
Read MoreLow Ag
Read MoreCompatible with formic acid reflow
Read MoreLess flux residue
Read MoreLow melting point
Read MoreGeneral use
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreEpoxy resin low melting point
Read MoreEpoxy resin
Read MoreLow void
Read MoreFor laser
Read MoreWater-soluble
Read MoreHigh strength
Read MoreCompatible with Ni
Read MoreLow Ag
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHalogen-free low silver
Read More