Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Hallogen Free
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Non-Halogen solder paste with low melting point
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Low Ag
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Compatible with formic acid reflow
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Less flux residue
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Low melting point
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General use
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Epoxy resin
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Low void
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For laser
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Water-soluble
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High strength
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Compatible with Ni
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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