Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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High strength
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Compatible with formic acid reflow
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General use
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Low melting point
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Water-soluble
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General use(compatible with normal temperature strage)
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Low Ag
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For laser
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Epoxy resin
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Halogen-free low silver
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Less flux residue
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Halogen free (compatible with normal temperature storage)
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Low void
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Low Ag
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Compatible with Ni
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