Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Compatible with formic acid reflow
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Low melting point
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High strength
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Epoxy resin
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Water-soluble
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Less flux residue
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Compatible with Ni
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Low void
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General use
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General use(compatible with normal temperature strage)
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For laser
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Hallogen Free
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Non-Halogen solder paste with low melting point
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Halogen-free low silver
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Epoxy resin low melting point
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