Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Low void
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Compatible with Ni
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Low Ag
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Low melting point
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General use(compatible with normal temperature strage)
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Less flux residue
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Epoxy resin
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General use
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Water-soluble
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Hallogen Free
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Compatible with formic acid reflow
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For laser
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Low Ag
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Epoxy resin low melting point
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High strength
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