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universal solder with good solderability and low spattering

Achieved both “surprising wettability” and “ultra-low spattering”.
High-dimension compatible cored solder. (JIS AA type Sn-3.0Ag-0.5Cu)

Spattering suppression effect

TNP-NP303 has less spattering compared to conventional Sn-3Ag-0.5Cu products.



TNP-NP303 maintains the same level of wettability as the conventional Sn-3Ag-0.5Cu product.


Basic characteristics

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