Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Less flux residue
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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General use
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Hallogen Free
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Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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Compatible with Ni
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Low melting point
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Compatible with formic acid reflow
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Low void
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Water-soluble
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Low Ag
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Low Ag
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For laser
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Halogen-free low silver
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High strength
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Epoxy resin
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