Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
High strength
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Compatible with formic acid reflow
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Water-soluble
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General use
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For laser
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Halogen-free low silver
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Low Ag
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Low void
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Compatible with Ni
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Low melting point
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Non-Halogen solder paste with low melting point
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Low Ag
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Epoxy resin low melting point
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Less flux residue
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General use(compatible with normal temperature strage)
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Hallogen Free
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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