Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Solder paste for power devices
Compatible to formic acid reflow oven
Bonding without cleaning is possible because there is less flux residue
Formic acid reflow test results
Basic characteristics
Non-Halogen solder paste with low melting point
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For laser
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General use(compatible with normal temperature strage)
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General use
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Low Ag
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Compatible with Ni
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High strength
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Low melting point
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Epoxy resin low melting point
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Less flux residue
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Low Ag
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Hallogen Free
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Epoxy resin
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Water-soluble
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Compatible with formic acid reflow
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Low void
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