Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
For laser
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Less flux residue
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Water-soluble
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Compatible with Ni
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Low melting point
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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General use
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Hallogen Free
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Compatible with formic acid reflow
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Epoxy resin low melting point
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Low Ag
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Low void
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Halogen-free low silver
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High strength
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Epoxy resin
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