Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Residue-less solder paste
Residue-less solder paste that leaves almost no flux residue after reflow.
Excellent wettability！
Excellent wettability even for base materials that are hard to get wet, such as Ni.
Basic characteristics
Compatible with Ni
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Compatible with formic acid reflow
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General use
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Low Ag
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Epoxy resin low melting point
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Low melting point
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High strength
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Non-Halogen solder paste with low melting point
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Water-soluble
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For laser
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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General use(compatible with normal temperature strage)
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Low void
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Less flux residue
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