Improved thermal shock resistance and shock resistance
Enables reflow at low temperature with good wettability and printability
Significant improved reliability of joint strength, compare to conventional solder with low melting point
Test for thermal shock resistace
Reliability is the same or more than Sn-3.0Ag-0.5Cu
Test for shock resistance
Improved shock resistance
Basic characteristics
Compatible with formic acid reflow
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Low void
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General use
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General use(compatible with normal temperature strage)
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Compatible with Ni
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Epoxy resin
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Epoxy resin low melting point
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Low melting point
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High strength
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Halogen free (compatible with normal temperature storage)
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For laser
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Low Ag
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Less flux residue
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Hallogen Free
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Low Ag
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