Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Compatible with formic acid reflow
Read MoreFor laser
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreHallogen Free
Read MoreHalogen-free low silver
Read MoreLess flux residue
Read MoreEpoxy resin low melting point
Read MoreNon-Halogen solder paste with low melting point
Read MoreWater-soluble
Read MoreLow melting point
Read MoreGeneral use
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreEpoxy resin
Read MoreLow Ag
Read MoreCompatible with Ni
Read MoreLow Ag
Read More