Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
Halogen-free low silver
Read MoreEpoxy resin low melting point
Read MoreLow Ag
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreWater-soluble
Read MoreFor laser
Read MoreHallogen Free
Read MoreHigh strength
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreCompatible with formic acid reflow
Read MoreLow Ag
Read MoreGeneral use
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreEpoxy resin
Read MoreLess flux residue
Read MoreLow melting point
Read MoreCompatible with Ni
Read MoreNon-Halogen solder paste with low melting point
Read More