Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Achieved ultra-low void of 5% or less
Achieved ultra-low void by significantly increasing the fluidity of the flux, compared to conventional paste.
Void suppression
Basic characteristics
General use
Read MoreHalogen-free low silver
Read MoreHallogen Free
Read MoreCompatible with formic acid reflow
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreHigh strength
Read MoreCompatible with Ni
Read MoreFor laser
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLess flux residue
Read MoreLow melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreWater-soluble
Read MoreNon-Halogen solder paste with low melting point
Read MoreEpoxy resin low melting point
Read MoreLow Ag
Read MoreLow Ag
Read MoreEpoxy resin
Read More