Our Product

PW233-ST355-GQ-4

0.3Ag composition solder paste

Excellent stability of viscosity under hot and humid environment
Excellent continuous printing performance while adding paste

Test result of continuous printing under high temperature and humidity

Able to use even under hot and humid environment with minimal change of viscosity

 

Test result of continuous printing while adding paste

When printing while adding paste, there is almost no deterioration in properties even after 7 days of use.

 

Basic characteristics

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