0.3Ag composition solder paste
Excellent stability of viscosity under hot and humid environment
Excellent continuous printing performance while adding paste
0.3Ag composition solder paste
Excellent stability of viscosity under hot and humid environment
Excellent continuous printing performance while adding paste
Test result of continuous printing under high temperature and humidity
Able to use even under hot and humid environment with minimal change of viscosity
Test result of continuous printing while adding paste
When printing while adding paste, there is almost no deterioration in properties even after 7 days of use.
Basic characteristics