Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Formic acid reflow test results
Basic characteristics
Less flux residue
Read MoreNon-Halogen solder paste with low melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLow melting point
Read MoreHallogen Free
Read MoreCompatible with Ni
Read MoreGeneral use
Read MoreHigh strength
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHalogen-free low silver
Read MoreLow void
Read MoreEpoxy resin
Read MoreLow Ag
Read MoreWater-soluble
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreEpoxy resin low melting point
Read MoreFor laser
Read MoreLow Ag
Read More