Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Formic acid reflow test results
Basic characteristics
Low Ag
Read MoreFor laser
Read MoreEpoxy resin low melting point
Read MoreLess flux residue
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreCompatible with Ni
Read MoreHalogen-free low silver
Read MoreHallogen Free
Read MoreGeneral use
Read MoreLow Ag
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreNon-Halogen solder paste with low melting point
Read MoreEpoxy resin
Read MoreLow void
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreLow melting point
Read MoreWater-soluble
Read More