Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Formic acid reflow test results
Basic characteristics
Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Formic acid reflow test results
Basic characteristics
Halogen free (compatible with normal temperature storage)
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Low void
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Epoxy resin
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High strength
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Compatible with Ni
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Epoxy resin low melting point
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Water-soluble
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General use(compatible with normal temperature strage)
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For laser
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Low Ag
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Less flux residue
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Low Ag
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Low melting point
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Hallogen Free
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Non-Halogen solder paste with low melting point
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General use
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