Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Formic acid reflow test results
Basic characteristics
Low melting point
Read MoreEpoxy resin low melting point
Read MoreHallogen Free
Read MoreLow Ag
Read MoreWater-soluble
Read MoreLow void
Read MoreHalogen-free low silver
Read MoreNon-Halogen solder paste with low melting point
Read MoreGeneral use
Read MoreLow Ag
Read MoreLess flux residue
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreEpoxy resin
Read MoreCompatible with Ni
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreFor laser
Read MoreGeneral use(compatible with normal temperature strage)
Read More