Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Residue-less solder paste for formic acid reflow oven
Residue-less solder paste for formic acid reflow oven.
No need for cleaning due to less flux residue.
Formic acid reflow test results
Basic characteristics
Non-Halogen solder paste with low melting point
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreFor laser
Read MoreHalogen-free low silver
Read MoreLow Ag
Read MoreCompatible with Ni
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLow melting point
Read MoreGeneral use
Read MoreHallogen Free
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreWater-soluble
Read MoreEpoxy resin
Read MoreHigh strength
Read MoreEpoxy resin low melting point
Read MoreLess flux residue
Read MoreLow Ag
Read MoreLow void
Read More