Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Low melting point
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Halogen free (compatible with normal temperature storage)
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For laser
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Epoxy resin
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Compatible with formic acid reflow
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Compatible with Ni
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Low Ag
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High strength
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Low void
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Epoxy resin low melting point
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General use(compatible with normal temperature strage)
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Water-soluble
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General use
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