Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Low void
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Low Ag
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Halogen free (compatible with normal temperature storage)
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General use
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Epoxy resin low melting point
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Halogen-free low silver
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High strength
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Epoxy resin
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Water-soluble
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Compatible with Ni
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Low melting point
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For laser
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Low Ag
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Compatible with formic acid reflow
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