Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
For laser
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High strength
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Halogen-free low silver
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Low Ag
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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Epoxy resin low melting point
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Compatible with formic acid reflow
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Low melting point
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Low Ag
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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General use
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Hallogen Free
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Low void
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Compatible with Ni
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