Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Water-soluble
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General use
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General use(compatible with normal temperature strage)
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Epoxy resin low melting point
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Low void
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Compatible with Ni
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Epoxy resin
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Low Ag
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Low Ag
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Compatible with formic acid reflow
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High strength
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For laser
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Low melting point
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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