Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Low Ag
Read MoreLow melting point
Read MoreLow void
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHalogen-free low silver
Read MoreHigh strength
Read MoreGeneral use
Read MoreCompatible with Ni
Read MoreNon-Halogen solder paste with low melting point
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreWater-soluble
Read MoreEpoxy resin low melting point
Read MoreFor laser
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHallogen Free
Read MoreCompatible with formic acid reflow
Read MoreLow Ag
Read MoreEpoxy resin
Read More