Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Low Ag
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Low melting point
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Low void
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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High strength
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General use
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Compatible with Ni
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Non-Halogen solder paste with low melting point
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General use(compatible with normal temperature strage)
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Water-soluble
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Epoxy resin low melting point
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For laser
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Compatible with formic acid reflow
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Low Ag
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Epoxy resin
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