Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Epoxy resin low melting point
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Low Ag
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General use
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Low void
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Water-soluble
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Compatible with Ni
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For laser
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Epoxy resin
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High strength
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Non-Halogen solder paste with low melting point
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Low Ag
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General use(compatible with normal temperature strage)
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Hallogen Free
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Low melting point
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