Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Less flux residue type solder paste
Solder paste with almost noflux residue after reflow.
Excellent wettability
Excellent wettability for even base materials that are hard to wet such as Ni
Basic characteristics
Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Water-soluble
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Low void
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Compatible with formic acid reflow
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Epoxy resin low melting point
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Non-Halogen solder paste with low melting point
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For laser
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Hallogen Free
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General use(compatible with normal temperature strage)
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Low melting point
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Low Ag
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Low Ag
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High strength
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General use
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