Low Ag
Significant cost reduction is realized by low silver composition.
Higher joint strength and better thermal shock resistance compared with Sn-3Ag-0.5Cu.
Even delivery and storage under normal temperature, our solder paste can remain in stable
quality without deterioration unlike the conventional type . it become easier to handle.
Designed for preventing BGA Head-In-Pillow defect
PW231 joint reliability
Normal temperature safe keeping
Designed for preventing BGA Head-In-Pillow defect
Basic characteristics
Low Ag
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Hallogen Free
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Non-Halogen solder paste with low melting point
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High strength
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Less flux residue
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Halogen-free low silver
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For laser
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Epoxy resin low melting point
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Low void
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Low melting point
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Compatible with Ni
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Epoxy resin
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General use
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Compatible with formic acid reflow
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Water-soluble
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