Our Product

PW231-ST355-GQ-CC-1

Low Ag

Significant cost reduction is realized by low silver composition.
Higher joint strength and better thermal shock resistance compared with Sn-3Ag-0.5Cu.
Even delivery and storage under normal temperature, our solder paste can remain in stable
quality without deterioration unlike the conventional type . it become easier to handle.
Designed for preventing BGA Head-In-Pillow defect

PW231 joint reliability

 

Normal temperature safe keeping

 

Designed for preventing BGA Head-In-Pillow defect

 

Basic characteristics

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