Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Compatible with Ni
Read MoreWater-soluble
Read MoreFor laser
Read MoreEpoxy resin low melting point
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreGeneral use
Read MoreHigh strength
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreCompatible with formic acid reflow
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHallogen Free
Read MoreLow Ag
Read MoreLow Ag
Read MoreLess flux residue
Read MoreEpoxy resin
Read MoreHalogen-free low silver
Read MoreNon-Halogen solder paste with low melting point
Read MoreLow void
Read More