Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low Ag
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High strength
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Halogen-free low silver
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Water-soluble
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Low void
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Low Ag
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Compatible with Ni
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General use
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General use(compatible with normal temperature strage)
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For laser
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Less flux residue
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Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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