Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Compatible with Ni
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Water-soluble
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For laser
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Epoxy resin low melting point
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General use(compatible with normal temperature strage)
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General use
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High strength
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Low Ag
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Low Ag
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Less flux residue
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Epoxy resin
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Halogen-free low silver
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Non-Halogen solder paste with low melting point
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Low void
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