Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Hallogen Free
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Less flux residue
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Halogen-free low silver
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High strength
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Low void
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For laser
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Compatible with formic acid reflow
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General use
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Compatible with Ni
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Water-soluble
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Low Ag
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Epoxy resin low melting point
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