Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin low melting point
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High strength
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Compatible with formic acid reflow
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Hallogen Free
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Non-Halogen solder paste with low melting point
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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Compatible with Ni
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Low void
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Low Ag
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General use
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For laser
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General use(compatible with normal temperature strage)
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Low Ag
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