Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
General use(compatible with normal temperature strage)
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Low Ag
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Epoxy resin low melting point
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High strength
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General use
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Halogen free (compatible with normal temperature storage)
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Non-Halogen solder paste with low melting point
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Compatible with Ni
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Epoxy resin
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Low void
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Compatible with formic acid reflow
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Less flux residue
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For laser
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Halogen-free low silver
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Water-soluble
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Hallogen Free
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