Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin
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For laser
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Non-Halogen solder paste with low melting point
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Low void
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Epoxy resin low melting point
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Less flux residue
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General use
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Low Ag
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Compatible with formic acid reflow
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Compatible with Ni
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Hallogen Free
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Halogen-free low silver
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High strength
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