Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Halogen-free low silver
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General use
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Low Ag
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Halogen free (compatible with normal temperature storage)
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For laser
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Less flux residue
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Epoxy resin
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Hallogen Free
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Epoxy resin low melting point
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Non-Halogen solder paste with low melting point
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General use(compatible with normal temperature strage)
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Compatible with formic acid reflow
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Water-soluble
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High strength
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Compatible with Ni
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Low Ag
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Low void
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Halogen free (compatible with normal temperature storage)
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