Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Compatible with formic acid reflow
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Halogen free (compatible with normal temperature storage)
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General use(compatible with normal temperature strage)
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Less flux residue
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Epoxy resin low melting point
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Epoxy resin
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Low void
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Low Ag
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Compatible with Ni
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Low Ag
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Non-Halogen solder paste with low melting point
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Water-soluble
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General use
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High strength
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For laser
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Halogen-free low silver
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