Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Epoxy resin low melting point
Read MoreHigh strength
Read MoreCompatible with formic acid reflow
Read MoreWater-soluble
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHalogen-free low silver
Read MoreHallogen Free
Read MoreNon-Halogen solder paste with low melting point
Read MoreEpoxy resin
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLess flux residue
Read MoreCompatible with Ni
Read MoreLow void
Read MoreLow Ag
Read MoreGeneral use
Read MoreFor laser
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreLow Ag
Read More