Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Low melting point Pb Free solder paste
Power saving with low temperature reflow
Reduced thermal damage to components and boards.
Basic characteristics
Compatible with Ni
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Low Ag
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High strength
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Halogen free (compatible with normal temperature storage)
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For laser
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Non-Halogen solder paste with low melting point
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Epoxy resin low melting point
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Low Ag
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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General use(compatible with normal temperature strage)
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Water-soluble
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General use
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Compatible with formic acid reflow
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Low void
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Halogen-free low silver
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Hallogen Free
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Less flux residue
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