Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
For laser
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Low void
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High strength
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Low Ag
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Halogen-free low silver
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Halogen free (compatible with normal temperature storage)
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Epoxy resin
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Low melting point
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Low Ag
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General use
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General use(compatible with normal temperature strage)
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Less flux residue
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Water-soluble
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Non-Halogen solder paste with low melting point
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Compatible with formic acid reflow
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Epoxy resin low melting point
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