Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Water-soluble
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General use
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Halogen free (compatible with normal temperature storage)
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High strength
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Epoxy resin low melting point
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Halogen free (compatible with normal temperature storage)
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Low void
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Low melting point
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Halogen-free low silver
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Non-Halogen solder paste with low melting point
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Hallogen Free
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Low Ag
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Low Ag
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Epoxy resin
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General use(compatible with normal temperature strage)
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Compatible with formic acid reflow
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For laser
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Less flux residue
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