Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Epoxy resin low melting point
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Water-soluble
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Less flux residue
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Compatible with formic acid reflow
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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Halogen-free low silver
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Low melting point
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Low Ag
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High strength
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Halogen free (compatible with normal temperature storage)
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General use
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General use(compatible with normal temperature strage)
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Low Ag
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For laser
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Low void
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Epoxy resin
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Hallogen Free
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