Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Hallogen Free
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General use(compatible with normal temperature strage)
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Less flux residue
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Halogen free (compatible with normal temperature storage)
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High strength
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For laser
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Epoxy resin
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Epoxy resin low melting point
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Halogen-free low silver
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Low melting point
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Low Ag
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Low void
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Non-Halogen solder paste with low melting point
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Compatible with formic acid reflow
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General use
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