Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Non-Halogen solder paste with low melting point
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Low void
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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Low melting point
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General use
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Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Low Ag
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Water-soluble
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High strength
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Low Ag
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Epoxy resin low melting point
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Epoxy resin
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Halogen-free low silver
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For laser
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Less flux residue
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