Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Hallogen Free
Read MoreNon-Halogen solder paste with low melting point
Read MoreHigh strength
Read MoreGeneral use
Read MoreLow void
Read MoreLow Ag
Read MoreWater-soluble
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreCompatible with formic acid reflow
Read MoreLow Ag
Read MoreHalogen-free low silver
Read MoreEpoxy resin low melting point
Read MoreFor laser
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreLess flux residue
Read MoreEpoxy resin
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLow melting point
Read More