Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
General use(compatible with normal temperature strage)
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Epoxy resin
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Low void
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Low melting point
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Halogen-free low silver
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Low Ag
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Hallogen Free
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Low Ag
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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General use
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Less flux residue
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Non-Halogen solder paste with low melting point
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For laser
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Compatible with formic acid reflow
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Epoxy resin low melting point
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High strength
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Halogen free (compatible with normal temperature storage)
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