Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Halogen free (compatible with normal temperature storage)
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Hallogen Free
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Non-Halogen solder paste with low melting point
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Low Ag
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Less flux residue
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Epoxy resin
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Epoxy resin low melting point
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General use
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Compatible with formic acid reflow
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High strength
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General use(compatible with normal temperature strage)
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Halogen free (compatible with normal temperature storage)
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Low Ag
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Low melting point
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For laser
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Low void
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Halogen-free low silver
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Water-soluble
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