Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Halogen free (compatible with normal temperature storage)
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Halogen free (compatible with normal temperature storage)
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Less flux residue
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Non-Halogen solder paste with low melting point
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Low Ag
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Low void
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Water-soluble
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Low melting point
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For laser
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Compatible with formic acid reflow
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General use(compatible with normal temperature strage)
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General use
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Hallogen Free
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Epoxy resin low melting point
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Low Ag
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Epoxy resin
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High strength
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Halogen-free low silver
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