Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Low melting point
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Compatible with formic acid reflow
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Low void
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Epoxy resin low melting point
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Epoxy resin
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Low Ag
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For laser
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Non-Halogen solder paste with low melting point
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Halogen free (compatible with normal temperature storage)
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General use
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High strength
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Less flux residue
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Water-soluble
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General use(compatible with normal temperature strage)
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Halogen-free low silver
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Low Ag
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Hallogen Free
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Halogen free (compatible with normal temperature storage)
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