Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Water-soluble
Read MoreGeneral use
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreHigh strength
Read MoreEpoxy resin low melting point
Read MoreHalogen free (compatible with normal temperature storage)
Read MoreLow void
Read MoreLow melting point
Read MoreHalogen-free low silver
Read MoreNon-Halogen solder paste with low melting point
Read MoreHallogen Free
Read MoreLow Ag
Read MoreLow Ag
Read MoreEpoxy resin
Read MoreGeneral use(compatible with normal temperature strage)
Read MoreCompatible with formic acid reflow
Read MoreFor laser
Read MoreLess flux residue
Read More