Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Improved wettability to Ni
Improved wettability for base materials that are difficult to wet,
such as Ni, compared to conventional pastes.
Compatible with Ni plate
Basic characteristics
Hallogen Free
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Non-Halogen solder paste with low melting point
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High strength
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General use
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Low void
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Low Ag
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Water-soluble
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Halogen free (compatible with normal temperature storage)
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Compatible with formic acid reflow
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Low Ag
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Halogen-free low silver
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Epoxy resin low melting point
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For laser
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General use(compatible with normal temperature strage)
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Less flux residue
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Epoxy resin
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Halogen free (compatible with normal temperature storage)
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Low melting point
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